- EMI are pleased to be able to offer a wide range of conductive foil tapes designed specifically for EMI/RFI, ESD and Grounding applications. We have further developed these basic foil tapes into a range of conductive masking products including tapes and gaskets which we call “Bake and Peel”.
- The standard range of foil tapes are all coated with F2525 Silver filled acrylic adhesive which has extremely low electrical resistance and are as follows:-
F384 – High tensile Copper foil, readily accepts solder.
F385 – Tin Clad Copper foil, readily accepts solder, corrosion resistant.
F386 – High tensile Aluminium foil, high conformability for complex and intricate applications.
F577 – High tensile copper foil, which readily accepts solder and uses a Carbon adhesive for low a low cost solution.